Key Responsibilities

• Develop and troubleshoot ICP/RIE dry-etch processes for InP, Si and related materials.

• Develop wet-etch processes with precise control of etch rate and lateral undercut.

• Optimize gas chemistry, RF power and chamber pressure for etch rate, selectivity and sidewall stability.

• Use SEM and other tools to analyze sidewall morphology, aspect ratio and selectivity.

• Resolve product anomalies, monitor equipment capability and support routine maintenance.

• Prepare etching SOPs, work instructions and inspection reports.

• Partner with R&D on process improvements and new product introduction (NPI).

Requirements

• Bachelor’s degree or above in Microelectronics, Semiconductor Physics, Materials Science, Optoelectronics, Condensed Matter Physics or a related discipline.

• Hands-on dry-etch experience with GaAs, InP, Si or related compound-semiconductor materials.

• Proficient in mainstream ICP/RIE equipment, such as Oxford, LAM, STS, NAURA or equivalent.

• Strong understanding of plasma physics, surface chemistry and III-V material etching characteristics.

• Proficient in DOE and data analysis using JMP, Minitab or equivalent.

• Familiar with SEM, AFM, profilometers, ellipsometers and related characterization methods.

• Able to work in a cleanroom environment with strong safety awareness.

• Willing to travel or be assigned to external worksites when required.